Fanless Embedded Box PCs for Industrial Automation & Edge Computing

BaseIPC supplies fanless embedded box PC hardware for equipment manufacturers, industrial automation, machine vision, edge computing, and industrial data collection applications. Available options include flexible CPU platforms, configurable memory and storage, rich I/O interfaces, wireless modules, and custom mounting or enclosure designs for OEM production programs.

BaseIPC supplies industrial computing hardware platforms only. Application software, PLC programming, machine-vision software, control logic, and third-party runtime licenses are normally provided by the customer or system integrator. Optional Windows or Linux pre-installation is available for OEM projects, but application software development is not included.

Reference Hardware Platforms

Fanless configurations are available across compact, multi-I/O, and higher-performance platforms, with hardware options selected according to the application and integration requirements.

Fanless Embedded Box PC Models

Compare reference configurations by processor, interfaces, enclosure size and application. CPU, memory, storage and I/O options vary by model.

Model Reference Configuration Interfaces & Options Body Size (mm) Application Examples
BIPC-BOX120 Compact fanless Intel Celeron J4125 8GB RAM / 256GB storage 2 × HDMI
1 × COM optional
Single / dual LAN options
130.5 × 130.5 × 47 Space-limited kiosks, data-collection terminals and equipment monitoring.
BIPC-BOX140 Multi-I/O fanless 8th Gen Intel Core i5 U-series 8GB RAM / 256GB storage Up to 6 COM: 4 RS232 + 2 RS485
HDMI + VGA
Single / dual LAN options
204 × 218 × 52 PLC-connected equipment, serial-device gateways and industrial data acquisition.
BIPC-BOX150 Fanless Core platform 8th Gen Intel Core i5 U-series 8GB RAM / 256GB storage Up to 6 COM: 4 RS232 + 2 RS485
HDMI + VGA
Single / dual LAN options
200 × 200 × 70 Industrial control cabinets, equipment monitoring and edge data processing.

Active-Cooled Embedded Box PC Options

The following models use active cooling and are available for projects that allow fan-cooled hardware.

Model Reference Configuration Interfaces & Options Body Size (mm) Application Examples
BIPC-BOX110 Slim active-cooled Intel Celeron J4125 8GB RAM / 256GB storage 2 × COM optional
HDMI + VGA
Single / dual LAN options
197 × 197 × 40 Kiosk controllers, cabinet-mounted terminals and equipment monitoring.
BIPC-BOX100 Multi-COM active-cooled 8th Gen Intel Core i5 U-series 8GB RAM / 256GB storage 4 × RS232 option
HDMI + VGA
Single / dual LAN options
197 × 197 × 61 Serial-device integration, machine-control terminals and industrial data collection.

Configuration Options

Processor
Selected Celeron and Core platforms, depending on the model.
Memory
4GB / 8GB / 16GB, subject to motherboard compatibility.
Storage Capacity
128GB / 256GB / 512GB. Storage type and interface are confirmed per configuration.
LAN
Single or dual LAN configurations.
Wireless
Wi-Fi and Bluetooth options, depending on the selected motherboard and module.
Serial Interfaces
COM count and RS232 / RS485 arrangements depend on the model and configuration.

All listed models use 12V DC input. Reference configurations and application examples are provided for initial selection. Final CPU model, fitted interfaces and component specifications are confirmed in the quotation. Application suitability depends on software, workload and installation conditions. Application software is provided by the customer or system integrator.

Need Help Choosing a Model?

Tell us your application, quantity and required interfaces. Include a preferred model if you have one. For a different enclosure size, mounting arrangement or I/O layout, send your requirements for an OEM configuration review.

Request a Configuration & Quote

Regulatory Compliance & Documentation

CE / FCC / RoHS compliance documentation is available for applicable models and configurations. Final document scope is confirmed according to the selected model.

Key Features of Fanless Embedded Box PCs

  • Fanless passive cooling for reduced dust intake and lower maintenance
  • Flexible Intel® processor platforms for different industrial computing workloads
  • Configurable multi-LAN, multi-COM, USB, GPIO, display, and wireless I/O options
  • Compact enclosure and mounting options for cabinets, wall mounting, DIN-rail, and embedded installation
  • OEM/ODM hardware support for I/O layout, enclosure design, mounting, branding, and stable production platforms

Applications

  • Industrial automation equipment manufacturers and machine-control systems
  • Machine vision and automated inspection equipment
  • Edge computing and industrial equipment platforms
  • Industrial data acquisition and monitoring systems
  • AGV, AMR, robotics, and warehouse automation equipment
  • Kiosks and self-service equipment manufacturers

OEM/ODM Hardware Customization Options

BaseIPC supports OEM/ODM hardware customization for fanless embedded box PC programs. Hardware configurations can be defined according to production requirements, including processor platforms, memory, storage, I/O layout, mounting methods, enclosure structure, branding, BIOS settings, and optional Windows or Linux pre-installation. Our support focuses on hardware validation, stable configurations, and repeat manufacturing programs. Application software, PLC programming, control logic, and third-party runtime licenses are not included.

  • Processor, memory, and storage configuration
  • Custom I/O layouts including LAN, USB, COM, HDMI, VGA, GPIO, audio, and optional wireless or cellular modules
  • Fanless thermal and enclosure design based on processor platform and installation environment
  • Wall-mount, DIN-rail, cabinet, and embedded installation options
  • Production enclosure design, sheet-metal structure, surface finish, port layout, and logo branding
  • BIOS configuration and optional Windows or Linux pre-installation

For a fanless box PC quotation, please share the required processor platform, RAM, storage, LAN/COM/USB and display interfaces, wireless requirements, mounting method, operating system, application environment, estimated production volume, and destination country.