Compact embedded box PCs for automation control, machine vision, edge computing, and industrial data collection. BaseIPC supports low-MOQ OEM/ODM projects with flexible CPU, I/O, mounting, and thermal design options.
Technical Specifications
| Series / Model | Dimensions (mm) | CPU Support | I/O & COM | Thermal Design |
|---|---|---|---|---|
| BOX–L4C | 197 × 197 × 61 | 8th–10th Gen Core i3/i5/i7 | 4 × COM / 2 × Display / 8 × GPIO | Active / Dust Filter |
| BOX–M | 197 × 197 × 40 | Intel J4125 / Gemini Lake | 2 × COM / HDMI + VGA | Active Cooling |
| EPC–I17 | 200 × 200 × 70 | 8th–10th Gen Core i3/i5/i7 | 6 × COM / 2 × LAN / 8 × GPIO | Passive (Fanless) |
| EPC–Y12 | 163 × 125 × 53 | Intel Elkhart Lake / Bay Trail | Compact Design / 2 × HDMI | Passive (Fanless) |
| EPC–Y17 | 204 × 218 × 52 | 6th–10th Gen / J6412 / J1900 | 6 × COM / SIM Slot (5G Support) | Passive (Fanless) |
Key Features of Fanless Embedded Box
- Fanless passive cooling for reduced dust intake and lower maintenance
- Flexible Intel® processor options for industrial automation workloads
- Rich I/O support for PLCs, sensors, cameras, and factory equipment
- Compact enclosure design for cabinet, wall-mount, and embedded installation
- OEM/ODM support for custom ports, mounting, branding, and system configuration
Applications
- Industrial automation control
- Machine vision systems
- Edge computing and IoT gateways
- Industrial data collection
- Kiosk and self-service equipment
- Warehouse and logistics systems
OEM/ODM Customization Options
BaseIPC supports small-to-medium batch OEM/ODM customization for industrial box PC projects. Customers can adjust system configuration, I/O layout, mounting method, enclosure design, branding, and software setup based on the application environment.
- CPU, memory, and storage configuration
- I/O layout customization: LAN, USB, COM, HDMI, VGA, GPIO, audio, and optional wireless modules
- Fanless or active cooling design based on installation environment
- Wall-mount, DIN rail, cabinet, and embedded installation options
- Custom enclosure size, sheet metal structure, surface finish, and logo branding
- OS pre-installation, BIOS settings, and application-specific setup
Engineering & Manufacturing Excellence
BaseIPC supports small-to-medium batch OEM/ODM production from our facility in Panyu, Guangzhou. Our team integrates sheet metal fabrication, chassis customization, industrial computing hardware assembly, aging tests, and thermal calibration to help customers build reliable embedded systems for 24/7 industrial operation.
Send us your required CPU, RAM, storage, I/O ports, mounting method, operating environment, and estimated quantity. Our team will recommend a suitable configuration for sample testing or small-batch OEM production.